Jennie S. Hwang , Ph.D., D.Sc.
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  Commencement Speech


  Selected list of Keynote or Featured Speech

  • Keynote Speaker: "Power of Opportunity and Perspectives", American Association of University Women, 2014
  • Keynote Speaker: "Power of Opportunity", Women's Leadership Connection, SMTA, 2013
  • Featured Speaker: "Economic Analystsí Annual Conference - Emerging Technologies", Washington D.C., 2012.
  • Featured Speaker: "Technology in the Boardroom", National Association of Corporate Directors, 2012.
  • Featured speaker: "Anticipating Disruptive Technologies", DoD joint program, 2010
  • Featured speaker: "Renewable Energy - Business Model and Technology", Global Business Council, International Microelectronics and Packaging Society, 2010
  • Keynote speaker, "Renewable Energy, Smart Grid and Sustainable Energy Model," Industrial Technology and Research Institute (ITRI), Taiwan, 2009
  • Keynote speaker, "Innovation, Leadership and Entrepreneurship - Global Competitiveness, New Workforce and Education," Taiwan National University, 2009
  • Keynote Speaker: "Women's Art, Women's Vision", DoD, DSCC, National Women's History Month - Federal Women's Program, 2008
  • Commencement speaker - Ohio University, 2007
  • Commencement speaker - Kent State University, 2001
  • Keynote speaker: "Environment-friendly Lead-free Electronics for RoHS compliance", SMTA - Penn, 2007
  • Keynote speaker: "Microelectronics-Emerging Technologies", International Microelectronics & Packaging Annual Conference, Brazil, 2005
  • Featured speaker: "Globalization and Engineering Workforce", National Material Board and National Research Council, May 2004, Washington, D.C.
  • Keynote speaker: "Perspective & Innovation", SMT Vision Award, February, 2004, Anaheim, California
  • Featured Speaker: "Environment-friendly Lead-free Electronics-Solder Technology", InterNepcon--Japan, January, 2004, Tokyo, Japan
  • Keynote speaker: "Education, Technology and Workforce in the New Decade", John Carroll University, Cultural Awareness Series, March 2003.
  • Keynote speaker: "Women in Science and Engineering", Ursuline College, March 2003
  • Keynote speaker: "Education, Technology and Workforce in the New Decade", Bowling Green State University, June 2003.
  • Keynote speaker: "Our Role in the New Decade", Annual Conference, Organization of Chinese Americans-Professional Association, June 2003
  • Keynote speaker: "Meeting Market Demands-Electronics Industry", Annual Microelectronics Conference, Campinas, Brazil, August, 2002
  • Invited speaker: "New and Emerging Technologies for Electronic Packaging and Assemblies", American Chamber of Commerce, Sao Paulo, Brazil, August 2002
  • Keynote speaker: "New and Emerging Technologies for Electronic Packaging and Assembly", U.S. Patent and Trademark Office, Washington D.C., April 2002
  • Keynote speaker: "Science and Technology Enterprise", The International Conference on Advanced Science and Technology, Chicago, July 2002
  • Keynote speaker: "Women in Technology and Workforce-Challenges and Opportunities", Case Western Reserve University, Cleveland, Ohio, February, 2002
  • Keynote speaker: "Women in Science and Technology-Challenges and Opportunities", The Cultural and Economic Council of Taiwan, Chicago, July 2002
  • Keynote speaker: "Environment-Friendly Electronics Manufacturing", Hong Kong Productivity Council, Hong Kong, March 2002
  • Keynote speaker: "New and Emerging Technologies for Electronic Packaging and Assembly", February 2002, State University of New York-Buffalo
  • Keynote speaker: "New Workforce", American Society of Materials Information International, Pittsburgh, PA, March, 2001
  • Keynote speaker: "Women in Technology and Workforce-Challenges and Opportunities", February 13, 2001, University of Pennsylvania.
  • Keynote speaker: "Bright Future Program--YWCA", YWCA, Cleveland, May 7, 2001.
  • Keynote speaker: "Science and Engineering for Minority women", Howard Hughes Foundation, Smith College, April 7, 2001.
  • Keynote speaker: "Education, Technology, and the New Workforce", Distinguished Lecture Series, Ohio Aerospace Institute, April 28, 2000.
  • Featured speaker: "Emerging Technologies for Electronics packaging and Assembly", Australia, October, 2000
  • Featured speaker: "Emerging Technologies for Electronics packaging and Assembly", Durham, North Carolina, October 2000.
  • Featured speaker: "Emerging Technologies for Electronics packaging and Assembly", Singapore, October 2000.
  • Keynote speaker: "Environment-Friendly Electronics", Singapore, October, 2000
  • Featured speaker: "Emerging technologies for Electronics packaging and Assembly", Boston, September 2000.
  • Featured speaker: "Emerging technologies for Electronics packaging and Assembly", Chicago, September 2000.
  • Featured speaker: "SMT Manufacturing", Miami, Florida, September 2000.
  • Featured speaker: " Emerging technologies for Electronics packaging and Assembly", Minneapolis, MN, June 2000.
  • Featured speaker: " Emerging technologies for Electronics packaging and Assembly", Boston, June 2000.
  • Featured speaker: " Emerging technologies for Electronics packaging and Assembly", Minneapolis, MN, May 2000.
  • Featured speaker: " Emerging technologies for Electronics packaging and Assembly", New Mexico, April 2000.
  • Invited speaker: "Meeting Market Demands--New and Emerging Technologies for Electronic Packaging and Assemblies", Industrial technology Research Institute (ITRI), Taiwan, March 2000
  • Invited speaker: "Technology, Education and the New Workforce", Cheng Kung University, Tainan, Taiwan, March 2000
  • Keynote speaker, " Advanced Technologies of SMT Assembly", Tel Aviv, Israel, June 1999.
  • Featured speaker: "New and Emerging Technologies for Electronic Packaging and Assembly", France, 1999.
  • Featured speaker: "New and Emerging Technologies for Electronic Packaging and Assembly", Germany, 1999
  • Featured speaker: "New and Emerging Techniques for Electronic Packaging and Assembly", Sweden, 1999
  • Keynote speaker: "Modern Women Scientists & Engineers", Society of Women Engineers - CWRU, April 1999.
  • Keynote speaker: "Preparation for New Millennium - Technology, Education, and Workforce", ITRI, Taiwan, March 1999.
  • Keynote speaker: "Surface Mount Technology-Present & Future", ITRI and SMTA-Taiwan Chapter, Taiwan, August, 1998
  • Keynote speaker: ASM-Electronic Materials-Chicago, August 1998.
  • Featured speaker: "Advanced Microelectronics Interconnecting Technology", Hong Kong University of Science and Technology, Hong Kong, July, 1998.
  • Keynote speaker: "Modern Asian-Americans", Advancement of Asian-American Association, Lucent Technology, and July 1998.
  • Featured speaker: "New & Emerging Technologies for Electronic Packaging and Assembly", Motorola, August 1998.
  • Featured speaker: "Surface Mount Technology", ASM-NC meeting, January 1998.
  • Keynote speaker: "Surface Mount Manufacturing-Present and future", Microtech Conference, New York, and October 1997.
  • Keynote speaker: "Surface Mount Technology - Past, Present, Future", International Intersociety Electronic & Photonic Packaging Conference, June 1997, Hawaii.
  • Featured speaker: "Meeting Market Demands - New and Emerging Technologies for Electronics Packaging & Assembly", NEPCON-Shanghai, Shanghai, China, May 1997.
  • Keynote speaker: "New & Emerging Technologies for SMT", SMTA & ISHM Joint Conference, Philadelphia, March 1997.
  • Featured speaker: "Design & Reliability of Solders & Solder Interconnections", TMS, Orlando, February 1997.
  • Keynote speaker: "Modern University Women", Annual Meeting-American Association of University Women, 1996.
  • Featured speaker: Singapore National Electronic Packaging & Production Conference, Singapore, 1995.
  • Featured speaker: Singapore National Advanced Manufacturing Technology Institute, Singapore, 1994
  • Featured speaker: "Meeting Market Demands - New and Emerging Technologies in Electronics Industry", American Society of Mechanical Engineers-Electrical & Electronic Packaging Division, Annual Conference, San Francisco, 1995.
  • Keynote speaker: "Emerging Technologies - Electronic Packaging and Assembly", Scandinavia Electronic Component & Production Conference & Exhibition, Sweden, 1994.
  • Featured speaker: Singapore National Electronic Packaging & Production Conference, Singapore, 1994.
  • Keynote speaker: "Surface Mount Technology", Taipei International Automation & Machine Tool Conference/Exhibition, Taiwan, 1994.
  • Featured speaker: "Implementation of Surface Mount Technology for Competitive Electronics Manufacturing", Malaysia Microelectronic & Semiconductor Conference & Exhibition, July, Kula Lumpur, Malaysia, 1993.
  • Featured speaker: Singapore National Electronic Packaging & Production Conference, Singapore, 1992, 1994, 1995.
  • Featured speaker: Singapore Nanyoung University, Singapore, 1994
  • Keynote speaker: "Implementation of Surface Mount Technology", Hong-Kong Productivity Council-Surface Mount Technology, Hong-Kong, 1992.
  • Featured speaker and invited lecturer: Japan National Electronic Packaging & Production, Tokyo, Japan, January 1991.
  • Keynote speaker: "Surface Mount Technology", Industrial Technology Research Institute (ITRI), Taiwan, 1988
  • Keynote speaker: "Surface Mount Technology", Motorola Manufacturing Research Center, Chicago, 1987.
Selected List of Invited Lectures & Seminars:

  • Industry Lectures - 1985 to present (2017), across U.S. and abroad (27 countries)
  • "Electronics Assembly and Interconnections - Selected Topics for NASA", 2006
  • "Environment-friendly Lead-Free Electronics -Part 1: Introduction & Technology" Workbook, various and numerous invited lectures (organized by IPC, JEDEC, IEEE, SMTA, NEPCON, InterNepcon, IMAPS, etc...) 2006
  • "Environment-friendly Lead-Free Electronics -Part 2: Component Coating & PCB Surface Finish" Workbook, various and numerous invited lectures (organized by IPC, JEDEC, IEEE, SMTA, IMAPS, etc...) 2006
  • "Environment-friendly Lead-Free Electronics -Part 3: Implementation & Production" Workbook, various and numerous invited lectures (organized by IPC, JEDEC, IEEE, SMTA, IMAPS, etc...) 2006
  • "Environment-friendly Lead-Free Electronics -Part 4: Reliability & Manufacturing" Workbook, various and numerous invited lectures (organized by IPC, JEDEC, IEEE, SMTA, IMAPS, etc...) 2006
  • "Environment-friendly Lead-Free Electronics -Part 5: System Compatibility" Workbook, various and numerous invited lectures (organized by IPC, JEDEC, IEEE, SMTA, IMAPS, etc...) 2006