Selected List of Non-Technical Papers and Editorials:
- Solar Energy - Sweet Spot, Published by Global Solar Technology magazine, UK / Ireland, 2008
- Solar Energy - Photovoltaics, Published by Global Solar Technology magazine, UK / Ireland, 2008
- Solar Energy - Global perspectives, Published by Advancing Microelectronics (International Society of Microelectronics & Packaging), U.S.A., 2009
- Solar Energy - Solar Energy - 10 Reasons Why Oils Prices Should Not Deter Solar Energy Deployment, Published by Global Solar Technology magazine, UK / Ireland, 2009
- Contributing author: The Road to Scientific Success - Inspiring Life Stories of Prominent Researchers", World Scientific Publishing Company, PTE, Ltd., 2006.
- Jennie S. Hwang, "Globalization-Technology, Jobs and Trade", Surface Mount Technology, July 2004.
- Jennie S. Hwang, "Reflections on APEX 2004", Surface Mount Technology, May 2004.
- Jennie S. Hwang, "Outsourcing or Not and To What Extent", Surface Mount Technology, April 2003.
- Jennie S. Hwang, "What Can We Expect from Electronics Industry in 2003-Part 1", Surface Mount Technology, January 2003.
- Jennie S. Hwang, "What Can We Expect from Electronics Industry in 2003-Part 2", Surface Mount Technology, March 2003.
- Jennie S. Hwang, "An Address to Women Engineers", Surface Mount Technology, June 1999
- Jennie S. Hwang, "The Power of Innovation", , SMT Magazine, PennWell Publications, LTD, August 2001
- Jennie S. Hwang, "Asia's Financial Crisis - Another Perspective - Possible Out Comes & Impacts", Surface Mount Technology, October 1998
- Jennie S. Hwang, "What Can We Expect in 2002-Part 1", Surface Mount Technology, January 2002.
- Jennie S. Hwang, "Microelectronics in Brazil", Surface Mount Technology, November, 2002.
- Jennie S. Hwang, "What Can We Expect in 2002-Part 2", Surface Mount Technology, March 2002.
- Jennie S. Hwang, "Reflections from the SMTA International Conference", Surface Mount Technology, December 2001.
- Jennie S. Hwang, "International trade and Trade Promotion Authority", Surface Mount Technology, November 2001.
- Jennie S. Hwang, "Change and Coping with Change", Surface Mount Technology, October 2001.
- Jennie S. Hwang, "What Can We Expect in 2001-Part 1 - Welcoming the Digital Economy", Surface Mount Technology, January, 2001.
- Jennie S. Hwang, "What Can We Expect in 2001-Part 2 - Welcoming the Digital Economy", Surface Mount Technology, February, 2001
- Jennie S. Hwang, "What Can We Expect in 2001-Part 3 - Welcoming the Digital Economy", Surface Mount Technology, March, 2001.
- Jennie S. Hwang, "Leadership Inside and Outside the Industry", Surface Mount Technology, May, 2000, Page 20.
- Jennie S. Hwang, "Preparation for the New Millennium", Surface Mount Technology, January, 2000, Page 18.
- Jennie S. Hwang, "Education, Technology, and the New Workforce", Today's Manager, June-July, 1999
- Jennie S. Hwang, " Women in Technology", Today's Manager, August/September, 1999.
- Jennie S. Hwang, "Asia's Road to Economic Recovery", Today's Manager, Singapore Institute of Management, Singapore, December, 1998.
- Jennie S. Hwang, "What Can We Expect in 1999 - Part I", Surface Mount Technology, December, 1998.
- Jennie S. Hwang, "What Can We Expect in 1999 - Part II", Surface Mount Technology, December, 1999.
- Jennie S. Hwang, "What Can We Expect in 1999 - Part III", Surface Mount Technology, December, 1999.
- Jennie S. Hwang, "Education & Engineering Education", SMTA Newsletter, June, 1994.
- Jennie S. Hwang, "Asia's Financial Turmoil-Another Perspective", Advanced Materials & Processes, ASM Int'l, November, 1998.
- Jennie S. Hwang, "What can We Expect in 1998 - Part I?", Surface Mount Technology, February, 1998.
- Jennie S. Hwang, "What Can We Expect in 1998 - Part II?", Surface Mount Technology, March, 1998
- Jennie S. Hwang, "Reflections of NEPCON-West 98", surface Mount Technology, April, 1998.
- Jennie S. Hwang, "Asia's Financial Crisis-Another Perspective", Surface Mount Technology, September, 1998.
- Jennie S. Hwang, "Electronics Industry in China", Surface Mount Technology, July, 1997.
- Jennie S. Hwang, "International Inter-Society Information Exchange", Surface Mount Technology, August, 1997.
- Jennie S. Hwang, "Electronics Industry in China", Surface Mount Technology, July, 1997.
- Jennie S. Hwang, "International Inter-Society Information Exchange", Surface Mount Technology , August, 1997.
- Jennie S. Hwang, "What Can We Expect in 1997 - A Forecast", Surface Mount Technology, February, 1997.
- Jennie S. Hwang, "Surface Mount Technology - Past, Present and Future", Guest Editorial, Journal of The Microelectronics Society, January, 1996.
- Jennie S. Hwang, "Accelerated Equipment Depreciation - A productivity and Growth Enhancer", Surface Mount Technology, October, 1996
- Jennie S. Hwang, "Affirmative Action - Principle & Practice", The Plain Dealer, August, 1995.
- Jennie S. Hwang, "Transition of the Manufacturing Workforce", SMTA Newsletter, March, 1994
- Jennie S. Hwang, "Virtual Corporation", SMTA Newsletter, April, 1994
- Jennie S. Hwang, "U.S. Foreign Policy vs. The Asia Market", SMTA Newsletter, May 1994.
- Jennie S. Hwang, "Is There a Gender Gap:", SMTA Newsletter, August, 1994.
- Jennie S. Hwang, "Building Trade and Relations with China", The Plain Dealer, May, 1994.
- Jennie S. Hwang, "Management Issue-Innovation, Leadership & Competitiveness", Surface Mount Technology, May 1993, p. 88.
- Jennie S. Hwang, "Emerging Technologies of Semiconductor Industry", SMTA Newsletter, October, 1993.
Selected List of Technical Papers and Editorials:
- Jennie S. Hwang, "Diffusion in Quartz-Optical Applications", American Ceramic Society. Journal, 1974.
- Jennie S. Hwang and Nien -Cheng. Lee, "Unique Rheology of Solder Paste for Surface Mount technology", Int'l Symposium of Hybrid Microelectronics, 1984.
- Riccardo Vanzetti and Jennie S. Hwang, "Laser/Infrared Signature Feed Back Enhances Interconnection Reliability", Conference Proceedings, NEPCON-West, 1989.
- Jennie S. Hwang, "Soldering and Solder Paste Prospects", Surface Mount Technology, October, 1989, p. 56.
- Jennie S. Hwang, "Consideration for Surface Mounting Solder Paste", Conference Proceedings, International Electronic Packaging Society, Annual Symposium, 1987.
- Jennie S. Hwang, "Complex Concoction", Circuits Manufacturing, December, 1987.
- Jennie S. Hwang, "Rheology of Solder Paste: Theory and Practice",Technical Proceedings, Expo SMT '88, 1988.
- Jennie S. Hwang " Validity of Viscosity Measurement", SMART Conference Proceedings, 1988.
- Jennie S. Hwang, "Solder Joint Reliability", Technical Proceedings, EXPO SMT '88, 1988.
- Jennie S. Hwang, "Defects and Failure Phenomena of Solder Joints", International Symposium of Hybrid Microelectronics, 1988.
- Jennie S. Hwang and Richard M Vargas, "Solder Joint Reliability - Can Solder Creep?", Conference Proceedings, International Symposium of Hybrid Microelectronics, 1990.
- Jennie S. Hwang, "Controlled Atmosphere Soldering - Principle and Practice", Technical Proceedings, NEPCON-West, 1990.
- Jennie S. Hwang, "No-Clean Soldering and Solder Paste", Circuits Manufacturing, September, 1990, p. 41.
- Jennie S. Hwang, "The Future of SMT Soldering", Electronic Packaging and Production, November, 1990.
- Jennie S. Hwang, "New Developments in Fluxing & Fluxes", Electronic Packaging and Production, June, 1991, p. 90.
- Jennie S. Hwang, George Lucey, Roger Clough, James Marshall "Futuristic Solder--Utopia or Ultimate Performance", Surface Mount Technology, September, 1991, P.40.
- Roger B. Clough, Rajiv Patel, Jennie S. Hwang and George Lucey, "Preparation and Properties of Reflowed Paste and Bulk Composites ", Proceedings, National Electronic Packaging & Production Conference, 1991, p. 1256.
- James Marshall, George Lucey and Jennie Hwang, "Composites", Proceedings, IEEE Electronic Component Conference, May, 1991.
- Jennie S. Hwang, Z. Guo and George Lucey, "Strengthened Solder Materials for Electronic Packaging", Proceedings, Surface Mount International Conference, 1993, p. 662.
- Jennie S. Hwang, "Screen Printing," Surface Mount Technology, March, 1994, p. 44.
- Jennie S. Hwang, "Overview of Lead-Free ", Proceedings, Surface Mount International Conference, 1994, p. 405.
- Jennie S. Hwang and Z. Guo, "Solder Joint Reliability: Reflow Cooling Rate vs. Solder Joint Integrity - Part I", Proceedings, NEPCON-West, 1994, p. 1095.
- Jennie S. Hwang, "Solder Materials Development", SMT, March, 1995.
- Jennie S. Hwang, "Reflow Soldering", SMT, August, 1998.
- Jennie S. Hwang, "Solder Materials", SMT, March, 1996.
- Jennie S. Hwang & Holger Koenigsmann, "New Development in Lead-Free Solders", Proceedings, Surface Mount International SMI Conference, 1997.
- Jennie S. Hwang & Holger Koenigsmann, "Introduction to Creep & Fatigue in Solder Interconnection", SMT, July, 1997.
- Jennie S. Hwang and Z. Guo, "Solder Joint Reliability: Reflow Cooling Rate vs Solder Joint Integrity - Part II ", to be published.
- Jennie S. Hwang and Guo, " Environment-friendly Lead-Free Solders for Electronic Packaging and Assembly," Proceedings, Surface Mount International, 1993, p. 732.
- Jennie S. Hwang, "Solder Materials", Surface Mount Technology, March, 1995.
- Jennie S. Hwang, "Soldering--Trends and Predictions", Surface Mount Technology, January, 1994, p.14.
- Jennie S. Hwang, "Solder Materials: Important Physical Properties", Surface Mount Technology, February, 1994, p. 18
- Jennie S. Hwang, "Water-clean vs. No-clean", Surface Mount Technology, March, 1994, p. 20.
- Jennie S. Hwang, "Solder Flaws Place Joint Integrity at Risk", Surface Mount Technology, April, 1994, p. 18.
- Jennie S. Hwang, "Case Study Assesses No-clean Reliability", Surface Mount Technology, May, 1994 p. 20.
- Jennie S. Hwang, "Have You Heard of ROSA or PADS", Surface Mount Technology, June, 1994, p. 14.
- Jennie S. Hwang, "How Does Reflow Profile Affect Solder Joint Integrity", Surface Mount Technology, July, 1994. p. 16.
- Jennie S. Hwang, "BGA: Soldering Concerns and Defects", Surface Mount Technology, August, 1994, p. 18.
- Jennie S. Hwang, "Reliability of BGA Interconnections", Surface Mount Technology, September, 1994, p. 14.
- Jennie S. Hwang, "A BGA Package Menu", Surface Mount Technology, October, 1994, p. 20.
- Jennie S. Hwang, "The Role of Intermetallics in Interconnections", Surface Mount Technology, November, 1994, p. 14.
- Jennie S. Hwang, "The Role of Gold in Interconnections", Surface Mount Technology, December, 1994, p. 20.
- Jennie S. Hwang, "Overview of Lead-Free Solders" proceedings, SMI, 1994, p. 405.
- Jennie S. Hwang, "Low Cycle Fatigue vs. Thermomechanical Fatigue," Surface Mount Technology, January, 1995.
- Jennie S. Hwang, "Hybrid of QFP and BGA Architectures", Surface Mount Technology, February, 1995.
- Jennie S. Hwang, "Determining the Optimum Level of Oxygen for Nitrogen Atmosphere Reflow", Surface Mount Technology, March, 1995.
- Jennie S. Hwang, "Is Microstructure as Indicator for Good or Not-So-Good Solder Joints", Surface Mount Technology, April 1995.
- Jennie S. Hwang, "Minimizing Reflow Solder Balling--A Collaborative Efforts", Surface Mount Technology, May 1995.
- Jennie S. Hwang, "Strengthening Solder Materials", Surface Mount Technology, June 1995
- Jennie S. Hwang, "Chip-Scale Packaging and Assembly--Burgeoning Innovations", Surface Mount Technology, July 1995.
- Jennie S. Hwang, "It is a Pleasure When the Principle Works", Surface Mount Technology, August 1995.
- Jennie S. Hwang, "Factors of Solderability - Surface Mount Component Leads", Surface Mount Technology, September 1995.
- Jennie S. Hwang, "Printed Circuit Board - Surface Finish", Surface Mount Technology, October 1995.
- Jennie S. Hwang, "Soldering Standards", Surface Mount Technology, November 1995.
- Jennie S. Hwang, "Challenges in Modeling for Life Prediction", Surface Mount Technology, December 1995.
- Jennie S. Hwang, "Surface Mount Technology: 1980's vs. 1990's", Surface Mount Technology, January 1996.
- Jennie S. Hwang, "Surface Mount Technology - Past, Present and Future", The Journal of Microelectronics and Packaging Society, January/February, 1996.
- Jennie. S. Hwang, "Another Application Advantage from Solder Paste", Surface Mount Technology, February 1996.
- Jennie S. Hwang, "Intricacies of Data Interpretation--Art or Science?" Surface Mount Technology, March 1996.
- Jennie S. Hwang, "Solder Materials", Surface Mount Technology, March 1996.
- Jennie S. Hwang, "Environmentally Sound Manufacturing", Surface Mount Technology, April 1996.
- Jennie S. Hwang, "Innovations in Interconnections", Surface Mount Technology, May 1996.
- Jennie S. Hwang, "Effects of a Reflow Temperature Profile", Surface Mount Technology, June 1996.
- Jennie S. Hwang, "Optimal Mass Reflow Profile", Surface Mount Technology, July 1996.
- Jennie S. Hwang, "Practical Considerations to Minimize PBGA Cracks", Surface Mount Technology, August 1996.
- Jennie S. Hwang, "Voids in Solder Joints", Surface Mount Technology, September 1996.
- Jennie S. Hwang, "Accelerated Equipment Depreciation - A productivity and Growth Enhancer", Surface Mount Technology, October 1996.
- Jennie S. Hwang, "Rework and Repair - Facilitators", Surface Mount Technology, November 1996.
- Jennie S. Hwang, "Polyglycol - A culprit or not?" Surface Mount Technology, December 1996.
- Jennie S. Hwang, "Solder Fatigue or Creep", Surface Mount Technology, January 1997.
- Jennie S. Hwang, "What Can We Expect in 1997 - A Forecast", Surface Mount Technology, February 1997.
- Jennie S. Hwang, "Design and Use of Solder Paste for System Reliability", Surface Mount Technology, March 1997.
- Jennie S. Hwang, "Reflections from NEPCON West '97", Surface Mount Technology, April 1997.
- Jennie S. Hwang, "Reflow Profiling - Temperature Measurement", Surface Mount Technology, May 1997.
- Jennie S. Hwang, Options of Surface Mount IP Packages, Surface Mount Technology, June 1997.
- Jennie S. Hwang, "Why Lead-Free Solders?" Surface Mount Technology, September 1997.
- Jennie S. Hwang, "Will Flip Chip or Chip Scale Packages take over?" Surface Mount Technology, October 1997.
- Jennie S. Hwang, "The Mystery of Chip Scale Packages", Surface Mount Technology, November 1997.
- Jennie S. Hwang, "Reflections, of 1997", Surface Mount Technology, December, 1997
- Jennie S. Hwang, "The Solder Beading Phenomenon", Surface Mount Technology, January, 1998
- Jennie S. Hwang, "What Can We Expect in 1998 - Part I?" Surface Mount Technology, February 1998.
- Jennie S. Hwang, "What Can We Expect in 1998 - Part II?" Surface Mount Technology, March 1998.
- Jennie S. Hwang, "Reflections of NEPCON-West '98", Surface Mount Technology, April 1998.
- Jennie S. Hwang, "Comparison of 63Sn & 62Sn - Part I", Surface Mount Technology, May 1998.
- Jennie S. Hwang, "Further Comparison of 63Sn and 62Sn" Surface Mount Technology, June 1998.
- Jennie S. Hwang, "Mass Reflow - Prelude", Surface Mount Technology, July 1998.
- Jennie S. Hwang, "N2 Atmosphere Soldering - Passe or Future", Surface Mount Technology, August 1998.
- Jennie S. Hwang, "BGA Rework Considerations". Surface Mount Technology, November 1998.
- Jennie S. Hwang, "What Can We Expect in 1999 - Part I", Surface Mount Technology, December 1998.
- Jennie S. Hwang, "What Else Can We Expect in 1999 - Part II", Surface Mount Technology, January 1999.
- Jennie S. Hwang, "What Else Can We Expect in 1999 - Part III", Surface Mount Technology, February 1999.
- Jennie S. Hwang, "Solder Materials an Overview" Surface Mount Technology, step-by-step, March 1999.
- Jennie S. Hwang, "Engineering Education & Workforce", Surface Mount Technology, March 1999.
- Jennie S. Hwang, "BGA & CSP - Solder Spheres", Surface Mount Technology, April, 1999.
- Jennie S. Hwang, "Reflections from NEPCON West '99", Surface Mount Technology, May 1999.
- Jennie S. Hwang, "Lead-Free Solders: Year 2000 & Beyond", Surface Mount Technology, July, 1999
- Jennie S. Hwang, "Lead-Free Solders - Year 2000 & Beyond Part II -", Surface Mount Technology, August 1999.
- Jennie S. Hwang, "Evolution of Surface Mount Manufacturing in Southern China", September 1999.
- Jennie S. Hwang, "Promising Lead-Free Compositions ", Surface Mount Technology, October 1999.
- Jennie S. Hwang, "Laser Soldering", Surface Mount Technology, November 1999.
- Jennie S. Hwang, "Laser Soldering-A New Manufacturing System", Surface Mount Technology, December 1999.
- Jennie S. Hwang, "Preparation for the New Millennium--Technology, Education, and the new Workforce", Surface Mount Technology, January , 2000
- Jennie S. Hwang, "What Can We Expect in Year 2000-- Part I ", Surface Mount Technology, February 2000.
- Jennie S. Hwang, "What Can We Expect in Year 2000-- Part II ", Surface Mount Technology, March 2000.
- Jennie S. Hwang, "Pb, Ag, Bi, Sb-Free Solder System ", Surface Mount Technology, April 2000.
- Jennie S. Hwang, "Leadership-Inside and Outside the Industry ", Surface Mount Technology, May 2000.
- Jennie S. Hwang, "Environment-friendly Lead-Free Solder-- Sn/Ag/Bi System", Surface Mount Technology, June 2000.
- Jennie S. Hwang, "Environment-friendly Lead-Free Solder-- Sn/Ag/Cu System ", Surface Mount Technology, July 2000.
- Jennie S. Hwang, "A strong Lead-Free Candidate -- Sn/Ag/Cu/Bi System ", Surface Mount Technology, August 2000.
- Jennie S. Hwang, "Another strong Lead-Free Candidate -- Sn/Ag/Bi/In System ", Surface Mount Technology, September 2000.
- Jennie S. Hwang, "A fatigue-resistant Lead-Free Candidate -- Sn/Ag/Cu/In System", Surface Mount Technology, October 2000.
- Jennie S. Hwang, "Environment-friendly Lead-Free Solder - Sb effect in Sn/Ag", Surface Mount Technology, November 2000.
- Jennie S. Hwang, "The Myth of Bi in Solders-Part I", Surface Mount Technology,December 2000.
- Jennie S. Hwang, Holger Koenigsmann, "High Strength and High-Fatigue-Resistant Lead-free Solder", SMT, March 2000, Page 55.
- Jennie S. Hwang , "Overview of Solder Materials, Step-by-Step", SMT, March, 2000, Page 81
- Jennie S. Hwang and Z. Guo, " Effect of Bi Contamination on Sn/Pb Eutectic Solder", SMT, September 2000, Page 91.
- Jennie S. Hwang, "Overview of Lead Free Solders", SMT, March 2001, Page 60.
- Jennie S. Hwang and Z. Guo, " Effect of Pb Contamination on lead Free Solder-Part 1", Chip Scale Review, December 2000.
- Jennie S. Hwang and Z. Guo, " Effect of Pb Contamination on lead Free Solder-Part 2", Chip Scale Review, January/February, 2001.
- Jennie S. Hwang and Z. Guo, " Effect of Pb Contamination on lead Free Solder-Part 3", Chip Scale Review, March/April, 2001
- Jennie S. Hwang and Z. Guo, " Effect of Pb Contamination on lead Free Solder-Part 4", Chip Scale Review, May/June, 2001.
- Jennie S. Hwang and Z. Guo, " Effect of Pb Contamination on lead Free Solder-Part 5", Chip Scale Review, July/August, 2001.
- Jennie S. Hwang and Z. Guo, " Effect of Pb Contamination on lead Free Solder-Part 6", Chip Scale Review, September/October, 2001.
- Jennie S. Hwang and Z. Guo, " Effect of Pb Contamination on lead Free Solder-Part 7", Chip Scale Review, November 2001.
- Jennie S. Hwang and Z. Guo, " Effect of Pb Contamination on lead Free Solder-Part 8", Chip Scale Review, December 2001.
- Jennie S. Hwang, "What Can We Expect in 2001 - Welcoming the Digital Economy", Surface Mount Technology, January 2001.
- Jennie S. Hwang, "What Can We Expect in 2001 -- Semiconductors", Surface Mount Technology, February 2001.
- Jennie S. Hwang, "Reflections from Apex 2001", Surface Mount Technology, March 2001.
- Jennie S. Hwang, "Step-by-Step manufacturing-Soldering Materials", SMT Magazine, PennWell Publications, LTD, March 2001
- Jennie S. Hwang, "What Can We Expect in 2001 - IC and Passive Packages", Surface Mount Technology, April 2001.
- Jennie S. Hwang, "What Can We Expect in 2001 - Board level assembly", Surface Mount Technology, May 2001.
- Jennie S. Hwang, H. Koenigsmann & Zhenfeng Guo, "A High-Performance Lead-free Material-the effect of In on 99.5Sn0.7Cu", Soldering & Surface Mount Technology, Great Britain, Vol. 13, Number 2, 2001, P. 7
- Jennie S. Hwang, "Viable Lead-Free Compositions", Surface Mount Technology, June 2001.
- Jennie S. Hwang, "Selection Criteria: Lead-Free Compositions", Surface Mount Technology, July, 2001
- Jennie S. Hwang, "The Science and Applications of Bismuth", May 2001, Bismuth Institute, Brussels, Belgium
- Jennie S. Hwang, "The Power of Silicon", SMT Magazine, PennWell Publications, LTD, September 2001
- Jennie S. Hwang, "Overview of Soldering Joining for Electronics Industry", International Journal of Powder Metallurgy, October 2001
- Jennie S. Hwang, "Passive Components-Technology and Market", SMT Magazine, PennWell Publications, LTD, December, 2001
- Jennie S. Hwang, "What Can We Expect in 2002 in Electronics Industry-Part 1", Surface Mount Technology, PennWell Publications, LTD, January 2002
- Jennie S. Hwang, "What Can We Expect in 2002 in Electronics Industry-Part 2", Surface Mount Technology, PennWell Publications, LTD, March 2002
- Jennie S. Hwang, "Step-by-Step Manufacturing-Soldering Materials", SMT Magazine, PennWell Publications, LTD, March 2002
- Jennie S. Hwang, "What are the Top Two Parameters in Selecting a Lead-free Material?", SMT Magazine, PennWell Publications, LTD, June 2002
- Jennie S. Hwang, "Lead-Free Symposium at APEX", SMT Magazine, PennWell Publications, LTD, April 2002
- Jennie S. Hwang, "Anatomy of SnAgCu in SMT Applications", SMT Magazine, PennWell Publications, LTD, August, 2002
- Jennie S. Hwang, ET. al., "Environment-friendly Lead-Free technology and Applications in Electronics and Microelectronics", June/July issue, The Journal of International Microelectronics and Packaging Society, 2002
- Jennie S. Hwang, "What are Drop-in Lead-Free Alloys?", SMT Magazine, PennWell Publications, LTD, September, 2002
- Jennie S. Hwang, "Microelectronics Conference in Brazil", SMT Magazine, PennWell Publications, LTD, November, 2002
- Jennie S. Hwang, "What Can We Expect from the Electronics Industry in 2003-Part 1", Surface Mount Technology, January 2003
- Jennie S. Hwang, "What Can We Expect from the Electronics Industry in 2003-Part 2", Surface Mount Technology, March 2003
- Jennie S. Hwang, "Solder Materials-Step-by-Step", Surface Mount Technology, March 2003
- Jennie S. Hwang, "Outsource or Not and to What Extent", Surface Mount Technology, April 2003
- Jennie S. Hwang, "Comparative Wetting Ability of Lead-free Solder Alloys", Electronic Packaging and Production, April 2003
- Jennie S. Hwang, "The Evolution of Environment-friendly Lead-free Electronics on International Landscape", Surface Mount Technology, June 2003
- Jennie S. Hwang, "Revisiting Solder Paste", Surface Mount Technology, August 2003
- Jennie S. Hwang, "Environment-friendly Lead-Free Implementation-Two Approaches", Surface Mount Technology, November 2003
- Jennie S. Hwang, "Environment-friendly Lead-Free Implementation-Alloys for Two Approaches", Surface Mount Technology, December 2003
- Jennie S. Hwang, "Environment-friendly Lead-Free Implementation-No Need for Higher Temperature", Surface Mount Technology, January 2004
- Jennie S. Hwang, "Environment-friendly Lead-free Drop-in Implementation", Global Surface Mount Technology and Packaging, January-February Issue 2004 Great Britain
- Jennie S. Hwang, "Environment-friendly Lead-Free Implementation-Critical Production Consideration", Surface Mount Technology, March 2004
- Jennie S. Hwang, "Solder Materials-Step-by-Step", Surface Mount Technology, March 2004
- Jennie S. Hwang, "Changing the Factory to Lead-Free", Surface Mount Technology, June 2004, Page 56
- Jennie S. Hwang, "Dispel the Notions about Environment-friendly Lead-Free ", Surface Mount Technology, September 2004
- Jennie S. Hwang, "The Electronics Manufacturing Industry in Asia", Surface Mount Technology, November 2004
- Jennie S. Hwang, "Environment-friendly Lead-free Reliability", Surface Mount Technology, December 2004
- Jennie S. Hwang, "Environment-friendly Lead-free Production Success Requires an Open Mind-Part 1", EMSNow.com. December 2004
- Jennie S. Hwang, "Lead-free Banner Year", Surface Mount Technology, January 2005
- Jennie S. Hwang, "Environment-friendly Electronics-Cost Consideration", Surface Mount Technology, March 2005
- Jennie S. Hwang, "Bismuth in Pb-free System-Not to Fear, Part 1", Surface Mount Technology, June 2005
- Jennie S. Hwang, "Bismuth in Pb-free System-Not to Fear, Part 2", Surface Mount Technology, August 2005
- Jennie S. Hwang, "Cost of Ownership of Lead-free Assembly", Surface Mount Technology, November 2005
- Jennie S. Hwang, Interview Article: "The Future Trends of Electronics Industry", OnBoard, Brussels, Belgium, November 2005.
- Jennie S. Hwang, "The Electronics Industry Going Forward", Surface Mount Technology, January 2006.
- Jennie S. Hwang, "Lead-free Electronics-Future, Today & Past", U.S. Tech, February, 2006
- Contributing author: The Road to Scientific Success: Inspiring Life Stories of Prominent Researchers", World Scientific Publishing Company, PTE, Ltd., to be published 2006.
- Jennie S. Hwang, "How to Test & Assess Lead-free Reliability - Part 1", Surface Mount Technology, April, 2006.
- Jennie S. Hwang, "Low Temperature Lead-free Production vs. SAC", OnBoard Technology, On Publishing SA, Brussels, Belgium, May, 2006.
- Jennie S. Hwang, "How to Test & Assess Lead-free Reliability - Part 2", Surface Mount Technology, July, 2006.
- Jennie S. Hwang, "How to Test & Assess Lead-free Reliability - Part 3", Surface Mount Technology, August 2006.
- Jennie S. Hwang, " Materials ", Advancing Microelectronics - Special Edition, August 2006.
- Jennie S. Hwang, "How to Test & Assess Lead-free Reliability - Part 4", Surface Mount Technology, December 2006.
- Jennie S. Hwang, "Reliability for Harsh Environment Electronics - Part 5", Surface Mount Technology, March 2007.
- Jennie S. Hwang, "Reliability for Harsh Environment Electronics - Part 6", Surface Mount Technology, May, 2007.
- Jennie S. Hwang, "Reliability for Harsh Environment Electronics - Part 7", Surface Mount Technology, September 2007.
- Interview: "Future and Emerging Technologies", Global SMT and Packaging, September 2007.
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