Jennie S. Hwang , Ph.D., D.Sc.
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Selected Publications

List of Technology Books
(Sole-Authorship)

  • Jennie S. Hwang, "Implementing Environment-friendly Electronics", McGraw-Hill, New York, January 2005 (ISBN-0071430482)
  • Jennie S. Hwang, "Environment-Friendly Electronics: Lead- Free Technology", Electrochemical Publications, LTD, Great Britain, 31 Chapters, 900 Pages, 2001 (ISBN-0-90-115040-1)
  • Jennie S. Hwang, "Modern Solder Technology for Competitive Electronics Manufacturing", McGraw-Hill, New York, 20 Chapters, 600pages, 1996 (ISBN-0-07-031749-3)
  • Jennie S. Hwang, "IC Ball Grid Array & Fine Pitch Peripheral Interconnections", Electrochemical Publications, LTD, Great Britain, 1995 (ISBN-0-90-115029-0)
  • Jennie S. Hwang, Japanese version of "Solder Paste for Electronic Packaging: Technology & Applications for Surface Mount, Hybrid Circuits, and Component Manufacturing", Alkago Publications, Tokyo, Japan, 1991
  • Jennie S. Hwang, "Electronic Packaging: Technology and Applications for Surface Mount, Hybrid Circuits, and IC Component Manufacturing", Van Nostrand Reinhold, New York, 1989 (ISBN-0-442-20754-9)
List of Technology Books
(Co-Authorship)
  • Jennie S. Hwang, Chapter 9, "High Density Electronics and Interconnection Handbook", McGraw-Hill, New York, 2002
  • Jennie S. Hwang, Chapter 5, "Electronic Packaging and Interconnection Handbook", McGraw-Hill, New York, 2002
  • Jennie S. Hwang, Chapter 7, "Electronic Assembly Fabrication", McGraw-Hill, New York, 2001
  • Jennie S. Hwang, Chapter 14, "Handbook of Area Array Packaging Manufacturing & Assembly", McGraw-Hill, New York, 2001
  • Jennie S. Hwang, Chapter 5, "Electronic Packaging and Interconnection Handbook", McGraw-Hill, New York, 1999
  • Jennie S. Hwang, Chapter 5, "Electronic Packaging and Interconnection Handbook", McGraw-Hill, New York, 1996
  • Jennie S. Hwang, Chapter 5, "Handbook of Fine Pitch Surface Mount Technology", Van Nostrand Reinhold, New York, 1993
  • Jennie S. Hwang, Chapter 2, "Solder Joint Reliability," Van Nostrand Reinhold, New York, 1991
  • Jennie S. Hwang, Chapter 5, "Electronic Packaging and Interconnection Handbook", McGraw-Hill, New York, 1991
Book review

Excerpts from the review on Dr. Hwang's most recent two books on the global movement of environment-friendly electronics:

"...Dr. Jennie Hwang's second major book on lead-free electronics plays the ministerial role to its magisterial predecessor. The two books are the foundation of the technology and the real-world choices and trade-offs facing manufacturers seeking the most efficient and cost-effective ways to meet the challenge of converting to environment-friendly electronics. It is the facilitator, carrying us from the calm of the research laboratory to the clamor of the factory floor, where theories and realities collide... An impressive, unparalleled resource...a must for all involved in research, manufacturing...".

The McGraw-Hill Production Director note

"Dear Dr. Hwang:...I am happy when an experienced author with your high standards is pleased with her book. I appreciate your courtesy, promptness and attention to detail throughput the production process.

Your accomplishments are awesome, and your schedule is unbelievable. Having your secretary Vivian there when you were traveling was a tremendous help. I think she and I share deep admiration for your ability.

I, personally, am delighted to have had the opportunity of working with you.

Sincerely,
Peggy Lamb

P.S. It's "politically incorrect" but I risk repeating what I said to Vivian once - you have a fantastic brain, superb accomplishments, etc, and are gorgeous, too!

The McGraw-Hill Editorial Director comments

"McGraw-Hill takes pride in publishing Dr. Jennie Hwang's new book. The challenges of lead-free manufacturing are many, and will affect the electronics industry for many years to come. This book is an implementation roadmap...As such, it takes sophisticated theory and applies it in a manner both clear and eminently practical. This is McGraw-Hill's mission - the clear transmission of technical information from the realms of the theoretical into the workplace, with the goal of improving businesses, products, and lives - and nowhere in our publishing program this year is this mission better expressed than in Dr. Hwang's landmark work."

Editorial Director, EP&P Magazine comments

"Environmental concerns, specifically Lead-free electronics assembly, has risen to the forefront of industry trends today. No other issue occupies so much interest and debate among global electronics manufacturing professionals. Dr Hwang, the world's leading authority on this topic, has addressed the entire breadth of lead-free issues, ...she has encompassed the state of the industry today."

List of Technical Papers and Editorials:
(Available Upon Request)

Selected List of Non-Technical Papers and Editorials:
  • 2008 - present (a variety of editorials on corporate governance, trade, education and global market)
  • Solar Energy - Sweet Spot, Published by Global Solar Technology magazine, UK / Ireland, 2008
  • Solar Energy - Photovoltaics, Published by Global Solar Technology magazine, UK / Ireland, 2008
  • Solar Energy - Global perspectives, Published by Advancing Microelectronics (International Society of Microelectronics & Packaging), U.S.A., 2009
  • Solar Energy - Solar Energy - 10 Reasons Why Oils Prices Should Not Deter Solar Energy Deployment, Published by Global Solar Technology magazine, UK / Ireland, 2009
  • Contributing author: The Road to Scientific Success - Inspiring Life Stories of Prominent Researchers", World Scientific Publishing Company, PTE, Ltd., 2006.
  • Jennie S. Hwang, "Globalization-Technology, Jobs and Trade", Surface Mount Technology, July 2004.
  • Jennie S. Hwang, "Reflections on APEX 2004", Surface Mount Technology, May 2004.
  • Jennie S. Hwang, "Outsourcing or Not and To What Extent", Surface Mount Technology, April 2003.
  • Jennie S. Hwang, "What Can We Expect from Electronics Industry in 2003-Part 1", Surface Mount Technology, January 2003.
  • Jennie S. Hwang, "What Can We Expect from Electronics Industry in 2003-Part 2", Surface Mount Technology, March 2003.
  • Jennie S. Hwang, "An Address to Women Engineers", Surface Mount Technology, June 1999
  • Jennie S. Hwang, "The Power of Innovation", , SMT Magazine, PennWell Publications, LTD, August 2001
  • Jennie S. Hwang, "Asia's Financial Crisis - Another Perspective - Possible Out Comes & Impacts", Surface Mount Technology, October 1998
  • Jennie S. Hwang, "What Can We Expect in 2002-Part 1", Surface Mount Technology, January 2002.
  • Jennie S. Hwang, "Microelectronics in Brazil", Surface Mount Technology, November, 2002.
  • Jennie S. Hwang, "What Can We Expect in 2002-Part 2", Surface Mount Technology, March 2002.
  • Jennie S. Hwang, "Reflections from the SMTA International Conference", Surface Mount Technology, December 2001.
  • Jennie S. Hwang, "International trade and Trade Promotion Authority", Surface Mount Technology, November 2001.
  • Jennie S. Hwang, "Change and Coping with Change", Surface Mount Technology, October 2001.
  • Jennie S. Hwang, "What Can We Expect in 2001-Part 1 - Welcoming the Digital Economy", Surface Mount Technology, January, 2001.
  • Jennie S. Hwang, "What Can We Expect in 2001-Part 2 - Welcoming the Digital Economy", Surface Mount Technology, February, 2001
  • Jennie S. Hwang, "What Can We Expect in 2001-Part 3 - Welcoming the Digital Economy", Surface Mount Technology, March, 2001.
  • Jennie S. Hwang, "Leadership Inside and Outside the Industry", Surface Mount Technology, May, 2000, Page 20.
  • Jennie S. Hwang, "Preparation for the New Millennium", Surface Mount Technology, January, 2000, Page 18.
  • Jennie S. Hwang, "Education, Technology, and the New Workforce", Today's Manager, June-July, 1999
  • Jennie S. Hwang, " Women in Technology", Today's Manager, August/September, 1999.
  • Jennie S. Hwang, "Asia's Road to Economic Recovery", Today's Manager, Singapore Institute of Management, Singapore, December, 1998.
  • Jennie S. Hwang, "What Can We Expect in 1999 - Part I", Surface Mount Technology, December, 1998.
  • Jennie S. Hwang, "What Can We Expect in 1999 - Part II", Surface Mount Technology, December, 1999.
  • Jennie S. Hwang, "What Can We Expect in 1999 - Part III", Surface Mount Technology, December, 1999.
  • Jennie S. Hwang, "Education & Engineering Education", SMTA Newsletter, June, 1994.
  • Jennie S. Hwang, "Asia's Financial Turmoil-Another Perspective", Advanced Materials & Processes, ASM Int'l, November, 1998.
  • Jennie S. Hwang, "What can We Expect in 1998 - Part I?", Surface Mount Technology, February, 1998.
  • Jennie S. Hwang, "What Can We Expect in 1998 - Part II?", Surface Mount Technology, March, 1998
  • Jennie S. Hwang, "Reflections of NEPCON-West 98", surface Mount Technology, April, 1998.
  • Jennie S. Hwang, "Asia's Financial Crisis-Another Perspective", Surface Mount Technology, September, 1998.
  • Jennie S. Hwang, "Electronics Industry in China", Surface Mount Technology, July, 1997.
  • Jennie S. Hwang, "International Inter-Society Information Exchange", Surface Mount Technology, August, 1997.
  • Jennie S. Hwang, "Electronics Industry in China", Surface Mount Technology, July, 1997.
  • Jennie S. Hwang, "International Inter-Society Information Exchange", Surface Mount Technology , August, 1997.
  • Jennie S. Hwang, "What Can We Expect in 1997 - A Forecast", Surface Mount Technology, February, 1997.
  • Jennie S. Hwang, "Surface Mount Technology - Past, Present and Future", Guest Editorial, Journal of The Microelectronics Society, January, 1996.
  • Jennie S. Hwang, "Accelerated Equipment Depreciation - A productivity and Growth Enhancer", Surface Mount Technology, October, 1996
  • Jennie S. Hwang, "Affirmative Action - Principle & Practice", The Plain Dealer, August, 1995.
  • Jennie S. Hwang, "Transition of the Manufacturing Workforce", SMTA Newsletter, March, 1994
  • Jennie S. Hwang, "Virtual Corporation", SMTA Newsletter, April, 1994
  • Jennie S. Hwang, "U.S. Foreign Policy vs. The Asia Market", SMTA Newsletter, May 1994.
  • Jennie S. Hwang, "Is There a Gender Gap:", SMTA Newsletter, August, 1994.
  • Jennie S. Hwang, "Building Trade and Relations with China", The Plain Dealer, May, 1994.
  • Jennie S. Hwang, "Management Issue-Innovation, Leadership & Competitiveness", Surface Mount Technology, May 1993, p. 88.
  • Jennie S. Hwang, "Emerging Technologies of Semiconductor Industry", SMTA Newsletter, October, 1993.
Selected List of Technical Papers and Editorials:
  • Jennie S. Hwang, "Diffusion in Quartz-Optical Applications", American Ceramic Society. Journal, 1974.
  • Jennie S. Hwang and Nien -Cheng. Lee, "Unique Rheology of Solder Paste for Surface Mount technology", Int'l Symposium of Hybrid Microelectronics, 1984.
  • Riccardo Vanzetti and Jennie S. Hwang, "Laser/Infrared Signature Feed Back Enhances Interconnection Reliability", Conference Proceedings, NEPCON-West, 1989.
  • Jennie S. Hwang, "Soldering and Solder Paste Prospects", Surface Mount Technology, October, 1989, p. 56.
  • Jennie S. Hwang, "Consideration for Surface Mounting Solder Paste", Conference Proceedings, International Electronic Packaging Society, Annual Symposium, 1987.
  • Jennie S. Hwang, "Complex Concoction", Circuits Manufacturing, December, 1987.
  • Jennie S. Hwang, "Rheology of Solder Paste: Theory and Practice",Technical Proceedings, Expo SMT '88, 1988.
  • Jennie S. Hwang " Validity of Viscosity Measurement", SMART Conference Proceedings, 1988.
  • Jennie S. Hwang, "Solder Joint Reliability", Technical Proceedings, EXPO SMT '88, 1988.
  • Jennie S. Hwang, "Defects and Failure Phenomena of Solder Joints", International Symposium of Hybrid Microelectronics, 1988.
  • Jennie S. Hwang and Richard M Vargas, "Solder Joint Reliability - Can Solder Creep?", Conference Proceedings, International Symposium of Hybrid Microelectronics, 1990.
  • Jennie S. Hwang, "Controlled Atmosphere Soldering - Principle and Practice", Technical Proceedings, NEPCON-West, 1990.
  • Jennie S. Hwang, "No-Clean Soldering and Solder Paste", Circuits Manufacturing, September, 1990, p. 41.
  • Jennie S. Hwang, "The Future of SMT Soldering", Electronic Packaging and Production, November, 1990.
  • Jennie S. Hwang, "New Developments in Fluxing & Fluxes", Electronic Packaging and Production, June, 1991, p. 90.
  • Jennie S. Hwang, George Lucey, Roger Clough, James Marshall "Futuristic Solder--Utopia or Ultimate Performance", Surface Mount Technology, September, 1991, P.40.
  • Roger B. Clough, Rajiv Patel, Jennie S. Hwang and George Lucey, "Preparation and Properties of Reflowed Paste and Bulk Composites ", Proceedings, National Electronic Packaging & Production Conference, 1991, p. 1256.
  • James Marshall, George Lucey and Jennie Hwang, "Composites", Proceedings, IEEE Electronic Component Conference, May, 1991.
  • Jennie S. Hwang, Z. Guo and George Lucey, "Strengthened Solder Materials for Electronic Packaging", Proceedings, Surface Mount International Conference, 1993, p. 662.
  • Jennie S. Hwang, "Screen Printing," Surface Mount Technology, March, 1994, p. 44.
  • Jennie S. Hwang, "Overview of Lead-Free ", Proceedings, Surface Mount International Conference, 1994, p. 405.
  • Jennie S. Hwang and Z. Guo, "Solder Joint Reliability: Reflow Cooling Rate vs. Solder Joint Integrity - Part I", Proceedings, NEPCON-West, 1994, p. 1095.
  • Jennie S. Hwang, "Solder Materials Development", SMT, March, 1995.
  • Jennie S. Hwang, "Reflow Soldering", SMT, August, 1998.
  • Jennie S. Hwang, "Solder Materials", SMT, March, 1996.
  • Jennie S. Hwang & Holger Koenigsmann, "New Development in Lead-Free Solders", Proceedings, Surface Mount International SMI Conference, 1997.
  • Jennie S. Hwang & Holger Koenigsmann, "Introduction to Creep & Fatigue in Solder Interconnection", SMT, July, 1997.
  • Jennie S. Hwang and Z. Guo, "Solder Joint Reliability: Reflow Cooling Rate vs Solder Joint Integrity - Part II ", to be published.
  • Jennie S. Hwang and Guo, " Environment-friendly Lead-Free Solders for Electronic Packaging and Assembly," Proceedings, Surface Mount International, 1993, p. 732.
  • Jennie S. Hwang, "Solder Materials", Surface Mount Technology, March, 1995.
  • Jennie S. Hwang, "Soldering--Trends and Predictions", Surface Mount Technology, January, 1994, p.14.
  • Jennie S. Hwang, "Solder Materials: Important Physical Properties", Surface Mount Technology, February, 1994, p. 18
  • Jennie S. Hwang, "Water-clean vs. No-clean", Surface Mount Technology, March, 1994, p. 20.
  • Jennie S. Hwang, "Solder Flaws Place Joint Integrity at Risk", Surface Mount Technology, April, 1994, p. 18.
  • Jennie S. Hwang, "Case Study Assesses No-clean Reliability", Surface Mount Technology, May, 1994 p. 20.
  • Jennie S. Hwang, "Have You Heard of ROSA or PADS", Surface Mount Technology, June, 1994, p. 14.
  • Jennie S. Hwang, "How Does Reflow Profile Affect Solder Joint Integrity", Surface Mount Technology, July, 1994. p. 16.
  • Jennie S. Hwang, "BGA: Soldering Concerns and Defects", Surface Mount Technology, August, 1994, p. 18.
  • Jennie S. Hwang, "Reliability of BGA Interconnections", Surface Mount Technology, September, 1994, p. 14.
  • Jennie S. Hwang, "A BGA Package Menu", Surface Mount Technology, October, 1994, p. 20.
  • Jennie S. Hwang, "The Role of Intermetallics in Interconnections", Surface Mount Technology, November, 1994, p. 14.
  • Jennie S. Hwang, "The Role of Gold in Interconnections", Surface Mount Technology, December, 1994, p. 20.
  • Jennie S. Hwang, "Overview of Lead-Free Solders" proceedings, SMI, 1994, p. 405.
  • Jennie S. Hwang, "Low Cycle Fatigue vs. Thermomechanical Fatigue," Surface Mount Technology, January, 1995.
  • Jennie S. Hwang, "Hybrid of QFP and BGA Architectures", Surface Mount Technology, February, 1995.
  • Jennie S. Hwang, "Determining the Optimum Level of Oxygen for Nitrogen Atmosphere Reflow", Surface Mount Technology, March, 1995.
  • Jennie S. Hwang, "Is Microstructure as Indicator for Good or Not-So-Good Solder Joints", Surface Mount Technology, April 1995.
  • Jennie S. Hwang, "Minimizing Reflow Solder Balling--A Collaborative Efforts", Surface Mount Technology, May 1995.
  • Jennie S. Hwang, "Strengthening Solder Materials", Surface Mount Technology, June 1995
  • Jennie S. Hwang, "Chip-Scale Packaging and Assembly--Burgeoning Innovations", Surface Mount Technology, July 1995.
  • Jennie S. Hwang, "It is a Pleasure When the Principle Works", Surface Mount Technology, August 1995.
  • Jennie S. Hwang, "Factors of Solderability - Surface Mount Component Leads", Surface Mount Technology, September 1995.
  • Jennie S. Hwang, "Printed Circuit Board - Surface Finish", Surface Mount Technology, October 1995.
  • Jennie S. Hwang, "Soldering Standards", Surface Mount Technology, November 1995.
  • Jennie S. Hwang, "Challenges in Modeling for Life Prediction", Surface Mount Technology, December 1995.
  • Jennie S. Hwang, "Surface Mount Technology: 1980's vs. 1990's", Surface Mount Technology, January 1996.
  • Jennie S. Hwang, "Surface Mount Technology - Past, Present and Future", The Journal of Microelectronics and Packaging Society, January/February, 1996.
  • Jennie. S. Hwang, "Another Application Advantage from Solder Paste", Surface Mount Technology, February 1996.
  • Jennie S. Hwang, "Intricacies of Data Interpretation--Art or Science?" Surface Mount Technology, March 1996.
  • Jennie S. Hwang, "Solder Materials", Surface Mount Technology, March 1996.
  • Jennie S. Hwang, "Environmentally Sound Manufacturing", Surface Mount Technology, April 1996.
  • Jennie S. Hwang, "Innovations in Interconnections", Surface Mount Technology, May 1996.
  • Jennie S. Hwang, "Effects of a Reflow Temperature Profile", Surface Mount Technology, June 1996.
  • Jennie S. Hwang, "Optimal Mass Reflow Profile", Surface Mount Technology, July 1996.
  • Jennie S. Hwang, "Practical Considerations to Minimize PBGA Cracks", Surface Mount Technology, August 1996.
  • Jennie S. Hwang, "Voids in Solder Joints", Surface Mount Technology, September 1996.
  • Jennie S. Hwang, "Accelerated Equipment Depreciation - A productivity and Growth Enhancer", Surface Mount Technology, October 1996.
  • Jennie S. Hwang, "Rework and Repair - Facilitators", Surface Mount Technology, November 1996.
  • Jennie S. Hwang, "Polyglycol - A culprit or not?" Surface Mount Technology, December 1996.
  • Jennie S. Hwang, "Solder Fatigue or Creep", Surface Mount Technology, January 1997.
  • Jennie S. Hwang, "What Can We Expect in 1997 - A Forecast", Surface Mount Technology, February 1997.
  • Jennie S. Hwang, "Design and Use of Solder Paste for System Reliability", Surface Mount Technology, March 1997.
  • Jennie S. Hwang, "Reflections from NEPCON West '97", Surface Mount Technology, April 1997.
  • Jennie S. Hwang, "Reflow Profiling - Temperature Measurement", Surface Mount Technology, May 1997.
  • Jennie S. Hwang, Options of Surface Mount IP Packages, Surface Mount Technology, June 1997.
  • Jennie S. Hwang, "Why Lead-Free Solders?" Surface Mount Technology, September 1997.
  • Jennie S. Hwang, "Will Flip Chip or Chip Scale Packages take over?" Surface Mount Technology, October 1997.
  • Jennie S. Hwang, "The Mystery of Chip Scale Packages", Surface Mount Technology, November 1997.
  • Jennie S. Hwang, "Reflections, of 1997", Surface Mount Technology, December, 1997
  • Jennie S. Hwang, "The Solder Beading Phenomenon", Surface Mount Technology, January, 1998
  • Jennie S. Hwang, "What Can We Expect in 1998 - Part I?" Surface Mount Technology, February 1998.
  • Jennie S. Hwang, "What Can We Expect in 1998 - Part II?" Surface Mount Technology, March 1998.
  • Jennie S. Hwang, "Reflections of NEPCON-West '98", Surface Mount Technology, April 1998.
  • Jennie S. Hwang, "Comparison of 63Sn & 62Sn - Part I", Surface Mount Technology, May 1998.
  • Jennie S. Hwang, "Further Comparison of 63Sn and 62Sn" Surface Mount Technology, June 1998.
  • Jennie S. Hwang, "Mass Reflow - Prelude", Surface Mount Technology, July 1998.
  • Jennie S. Hwang, "N2 Atmosphere Soldering - Passe or Future", Surface Mount Technology, August 1998.
  • Jennie S. Hwang, "BGA Rework Considerations". Surface Mount Technology, November 1998.
  • Jennie S. Hwang, "What Can We Expect in 1999 - Part I", Surface Mount Technology, December 1998.
  • Jennie S. Hwang, "What Else Can We Expect in 1999 - Part II", Surface Mount Technology, January 1999.
  • Jennie S. Hwang, "What Else Can We Expect in 1999 - Part III", Surface Mount Technology, February 1999.
  • Jennie S. Hwang, "Solder Materials an Overview" Surface Mount Technology, step-by-step, March 1999.
  • Jennie S. Hwang, "Engineering Education & Workforce", Surface Mount Technology, March 1999.
  • Jennie S. Hwang, "BGA & CSP - Solder Spheres", Surface Mount Technology, April, 1999.
  • Jennie S. Hwang, "Reflections from NEPCON West '99", Surface Mount Technology, May 1999.
  • Jennie S. Hwang, "Lead-Free Solders: Year 2000 & Beyond", Surface Mount Technology, July, 1999
  • Jennie S. Hwang, "Lead-Free Solders - Year 2000 & Beyond Part II -", Surface Mount Technology, August 1999.
  • Jennie S. Hwang, "Evolution of Surface Mount Manufacturing in Southern China", September 1999.
  • Jennie S. Hwang, "Promising Lead-Free Compositions ", Surface Mount Technology, October 1999.
  • Jennie S. Hwang, "Laser Soldering", Surface Mount Technology, November 1999.
  • Jennie S. Hwang, "Laser Soldering-A New Manufacturing System", Surface Mount Technology, December 1999.
  • Jennie S. Hwang, "Preparation for the New Millennium--Technology, Education, and the new Workforce", Surface Mount Technology, January , 2000
  • Jennie S. Hwang, "What Can We Expect in Year 2000-- Part I ", Surface Mount Technology, February 2000.
  • Jennie S. Hwang, "What Can We Expect in Year 2000-- Part II ", Surface Mount Technology, March 2000.
  • Jennie S. Hwang, "Pb, Ag, Bi, Sb-Free Solder System ", Surface Mount Technology, April 2000.
  • Jennie S. Hwang, "Leadership-Inside and Outside the Industry ", Surface Mount Technology, May 2000.
  • Jennie S. Hwang, "Environment-friendly Lead-Free Solder-- Sn/Ag/Bi System", Surface Mount Technology, June 2000.
  • Jennie S. Hwang, "Environment-friendly Lead-Free Solder-- Sn/Ag/Cu System ", Surface Mount Technology, July 2000.
  • Jennie S. Hwang, "A strong Lead-Free Candidate -- Sn/Ag/Cu/Bi System ", Surface Mount Technology, August 2000.
  • Jennie S. Hwang, "Another strong Lead-Free Candidate -- Sn/Ag/Bi/In System ", Surface Mount Technology, September 2000.
  • Jennie S. Hwang, "A fatigue-resistant Lead-Free Candidate -- Sn/Ag/Cu/In System", Surface Mount Technology, October 2000.
  • Jennie S. Hwang, "Environment-friendly Lead-Free Solder - Sb effect in Sn/Ag", Surface Mount Technology, November 2000.
  • Jennie S. Hwang, "The Myth of Bi in Solders-Part I", Surface Mount Technology,December 2000.
  • Jennie S. Hwang, Holger Koenigsmann, "High Strength and High-Fatigue-Resistant Lead-free Solder", SMT, March 2000, Page 55.
  • Jennie S. Hwang , "Overview of Solder Materials, Step-by-Step", SMT, March, 2000, Page 81
  • Jennie S. Hwang and Z. Guo, " Effect of Bi Contamination on Sn/Pb Eutectic Solder", SMT, September 2000, Page 91.
  • Jennie S. Hwang, "Overview of Lead Free Solders", SMT, March 2001, Page 60.
  • Jennie S. Hwang and Z. Guo, " Effect of Pb Contamination on lead Free Solder-Part 1", Chip Scale Review, December 2000.
  • Jennie S. Hwang and Z. Guo, " Effect of Pb Contamination on lead Free Solder-Part 2", Chip Scale Review, January/February, 2001.
  • Jennie S. Hwang and Z. Guo, " Effect of Pb Contamination on lead Free Solder-Part 3", Chip Scale Review, March/April, 2001
  • Jennie S. Hwang and Z. Guo, " Effect of Pb Contamination on lead Free Solder-Part 4", Chip Scale Review, May/June, 2001.
  • Jennie S. Hwang and Z. Guo, " Effect of Pb Contamination on lead Free Solder-Part 5", Chip Scale Review, July/August, 2001.
  • Jennie S. Hwang and Z. Guo, " Effect of Pb Contamination on lead Free Solder-Part 6", Chip Scale Review, September/October, 2001.
  • Jennie S. Hwang and Z. Guo, " Effect of Pb Contamination on lead Free Solder-Part 7", Chip Scale Review, November 2001.
  • Jennie S. Hwang and Z. Guo, " Effect of Pb Contamination on lead Free Solder-Part 8", Chip Scale Review, December 2001.
  • Jennie S. Hwang, "What Can We Expect in 2001 - Welcoming the Digital Economy", Surface Mount Technology, January 2001.
  • Jennie S. Hwang, "What Can We Expect in 2001 -- Semiconductors", Surface Mount Technology, February 2001.
  • Jennie S. Hwang, "Reflections from Apex 2001", Surface Mount Technology, March 2001.
  • Jennie S. Hwang, "Step-by-Step manufacturing-Soldering Materials", SMT Magazine, PennWell Publications, LTD, March 2001
  • Jennie S. Hwang, "What Can We Expect in 2001 - IC and Passive Packages", Surface Mount Technology, April 2001.
  • Jennie S. Hwang, "What Can We Expect in 2001 - Board level assembly", Surface Mount Technology, May 2001.
  • Jennie S. Hwang, H. Koenigsmann & Zhenfeng Guo, "A High-Performance Lead-free Material-the effect of In on 99.5Sn0.7Cu", Soldering & Surface Mount Technology, Great Britain, Vol. 13, Number 2, 2001, P. 7
  • Jennie S. Hwang, "Viable Lead-Free Compositions", Surface Mount Technology, June 2001.
  • Jennie S. Hwang, "Selection Criteria: Lead-Free Compositions", Surface Mount Technology, July, 2001
  • Jennie S. Hwang, "The Science and Applications of Bismuth", May 2001, Bismuth Institute, Brussels, Belgium
  • Jennie S. Hwang, "The Power of Silicon", SMT Magazine, PennWell Publications, LTD, September 2001
  • Jennie S. Hwang, "Overview of Soldering Joining for Electronics Industry", International Journal of Powder Metallurgy, October 2001
  • Jennie S. Hwang, "Passive Components-Technology and Market", SMT Magazine, PennWell Publications, LTD, December, 2001
  • Jennie S. Hwang, "What Can We Expect in 2002 in Electronics Industry-Part 1", Surface Mount Technology, PennWell Publications, LTD, January 2002
  • Jennie S. Hwang, "What Can We Expect in 2002 in Electronics Industry-Part 2", Surface Mount Technology, PennWell Publications, LTD, March 2002
  • Jennie S. Hwang, "Step-by-Step Manufacturing-Soldering Materials", SMT Magazine, PennWell Publications, LTD, March 2002
  • Jennie S. Hwang, "What are the Top Two Parameters in Selecting a Lead-free Material?", SMT Magazine, PennWell Publications, LTD, June 2002
  • Jennie S. Hwang, "Lead-Free Symposium at APEX", SMT Magazine, PennWell Publications, LTD, April 2002
  • Jennie S. Hwang, "Anatomy of SnAgCu in SMT Applications", SMT Magazine, PennWell Publications, LTD, August, 2002
  • Jennie S. Hwang, ET. al., "Environment-friendly Lead-Free technology and Applications in Electronics and Microelectronics", June/July issue, The Journal of International Microelectronics and Packaging Society, 2002
  • Jennie S. Hwang, "What are Drop-in Lead-Free Alloys?", SMT Magazine, PennWell Publications, LTD, September, 2002
  • Jennie S. Hwang, "Microelectronics Conference in Brazil", SMT Magazine, PennWell Publications, LTD, November, 2002
  • Jennie S. Hwang, "What Can We Expect from the Electronics Industry in 2003-Part 1", Surface Mount Technology, January 2003
  • Jennie S. Hwang, "What Can We Expect from the Electronics Industry in 2003-Part 2", Surface Mount Technology, March 2003
  • Jennie S. Hwang, "Solder Materials-Step-by-Step", Surface Mount Technology, March 2003
  • Jennie S. Hwang, "Outsource or Not and to What Extent", Surface Mount Technology, April 2003
  • Jennie S. Hwang, "Comparative Wetting Ability of Lead-free Solder Alloys", Electronic Packaging and Production, April 2003
  • Jennie S. Hwang, "The Evolution of Environment-friendly Lead-free Electronics on International Landscape", Surface Mount Technology, June 2003
  • Jennie S. Hwang, "Revisiting Solder Paste", Surface Mount Technology, August 2003
  • Jennie S. Hwang, "Environment-friendly Lead-Free Implementation-Two Approaches", Surface Mount Technology, November 2003
  • Jennie S. Hwang, "Environment-friendly Lead-Free Implementation-Alloys for Two Approaches", Surface Mount Technology, December 2003
  • Jennie S. Hwang, "Environment-friendly Lead-Free Implementation-No Need for Higher Temperature", Surface Mount Technology, January 2004
  • Jennie S. Hwang, "Environment-friendly Lead-free Drop-in Implementation", Global Surface Mount Technology and Packaging, January-February Issue 2004 Great Britain
  • Jennie S. Hwang, "Environment-friendly Lead-Free Implementation-Critical Production Consideration", Surface Mount Technology, March 2004
  • Jennie S. Hwang, "Solder Materials-Step-by-Step", Surface Mount Technology, March 2004
  • Jennie S. Hwang, "Changing the Factory to Lead-Free", Surface Mount Technology, June 2004, Page 56
  • Jennie S. Hwang, "Dispel the Notions about Environment-friendly Lead-Free ", Surface Mount Technology, September 2004
  • Jennie S. Hwang, "The Electronics Manufacturing Industry in Asia", Surface Mount Technology, November 2004
  • Jennie S. Hwang, "Environment-friendly Lead-free Reliability", Surface Mount Technology, December 2004
  • Jennie S. Hwang, "Environment-friendly Lead-free Production Success Requires an Open Mind-Part 1", EMSNow.com. December 2004
  • Jennie S. Hwang, "Lead-free Banner Year", Surface Mount Technology, January 2005
  • Jennie S. Hwang, "Environment-friendly Electronics-Cost Consideration", Surface Mount Technology, March 2005
  • Jennie S. Hwang, "Bismuth in Pb-free System-Not to Fear, Part 1", Surface Mount Technology, June 2005
  • Jennie S. Hwang, "Bismuth in Pb-free System-Not to Fear, Part 2", Surface Mount Technology, August 2005
  • Jennie S. Hwang, "Cost of Ownership of Lead-free Assembly", Surface Mount Technology, November 2005
  • Jennie S. Hwang, Interview Article: "The Future Trends of Electronics Industry", OnBoard, Brussels, Belgium, November 2005.
  • Jennie S. Hwang, "The Electronics Industry Going Forward", Surface Mount Technology, January 2006.
  • Jennie S. Hwang, "Lead-free Electronics-Future, Today & Past", U.S. Tech, February, 2006
  • Contributing author: The Road to Scientific Success: Inspiring Life Stories of Prominent Researchers", World Scientific Publishing Company, PTE, Ltd., to be published 2006.
  • Jennie S. Hwang, "How to Test & Assess Lead-free Reliability - Part 1", Surface Mount Technology, April, 2006.
  • Jennie S. Hwang, "Low Temperature Lead-free Production vs. SAC", OnBoard Technology, On Publishing SA, Brussels, Belgium, May, 2006.
  • Jennie S. Hwang, "How to Test & Assess Lead-free Reliability - Part 2", Surface Mount Technology, July, 2006.
  • Jennie S. Hwang, "How to Test & Assess Lead-free Reliability - Part 3", Surface Mount Technology, August 2006.
  • Jennie S. Hwang, " Materials ", Advancing Microelectronics - Special Edition, August 2006.
  • Jennie S. Hwang, "How to Test & Assess Lead-free Reliability - Part 4", Surface Mount Technology, December 2006.
  • Jennie S. Hwang, "Reliability for Harsh Environment Electronics - Part 5", Surface Mount Technology, March 2007.
  • Jennie S. Hwang, "Reliability for Harsh Environment Electronics - Part 6", Surface Mount Technology, May, 2007.
  • Jennie S. Hwang, "Reliability for Harsh Environment Electronics - Part 7", Surface Mount Technology, September 2007.
  • Interview: "Future and Emerging Technologies", Global SMT and Packaging, September 2007.